CHO-BOND® 584-29 Two-Component Conductive Epoxy Adhesive – 2.5 Gram CHO PAK
CHO-BOND 584-29 by Parker Hannifin is a professional-grade two-component conductive epoxy adhesive available in 2.5 Gram CHO PAK format. Engineered for demanding industrial, aerospace, and OEM applications, this adhesive delivers exceptional bonding strength, chemical resistance, and long-term durability across a wide range of substrates including PCB, Metal Housings, EMI Shielding Applications. Silver-gray in color, it is trusted by engineers, maintenance professionals, and manufacturing specialists worldwide who require consistent, specification-grade performance in every application. The 2.5 Gram CHO PAK format is ideal for both prototype development and production use, offering convenient handling and precise dispensing with minimal waste. Whether you are bonding dissimilar materials, repairing structural components, or assembling precision parts, CHO-BOND 584-29 provides the adhesion reliability your application demands. Each batch is manufactured under strict quality control standards to ensure batch-to-batch consistency and compliance with applicable industry specifications. Suitable for aerospace, defense, automotive, marine, electronics, and general industrial assembly where high-performance adhesive bonding is critical.
| Attribute | Detail |
|---|---|
| Manufacturer Part Number (MPN) | 50-02-0584-0029 |
| Brand | Parker Hannifin |
| Product / Model Name | CHO-BOND 584-29 |
| Color | Silver-Gray |
| Package Size | 2.5 Gram CHO PAK |
| Product Type | Two-Component Conductive Epoxy Adhesive |
| Compatible Substrates | PCB, Metal Housings, EMI Shielding Applications |
Technical Information
CHO-BOND 584-29 is formulated as a two-component conductive epoxy adhesive delivering strong structural adhesion to PCB, Metal Housings, EMI Shielding Applications substrates. The 2.5 Gram CHO PAK packaging ensures accurate dispensing and minimizes waste during application. This product cures to form a tough, durable bond resistant to temperature extremes, moisture, and common industrial chemicals. Engineered to meet the performance demands of aerospace, defense, and precision manufacturing environments where bond integrity is non-negotiable.
Why Choose CHO-BOND 584-29?
- Professional Grade — Manufactured by Parker Hannifin for consistent, specification-grade performance
- Versatile Substrate Compatibility — Bonds effectively to PCB, Metal Housings, EMI Shielding Applications
- Two-Component Conductive Epoxy Adhesive — Purpose-designed chemistry for demanding bonding applications
- Convenient 2.5 Gram CHO PAK — Ready-to-use format for efficient application with minimal waste
- Quality Assured — Strict QC ensures batch-to-batch consistency and reliability
Frequently Asked Questions
Q: What is CHO-BOND 584-29 used for?
A: CHO-BOND 584-29 is a two-component conductive epoxy adhesive used for bonding PCB, Metal Housings, EMI Shielding Applications in aerospace, defense, industrial, and OEM manufacturing applications where high-strength, durable adhesion is required.
Q: What is the MPN for this product?
A: The Manufacturer Part Number (MPN) is 50-02-0584-0029.
Q: What surfaces does CHO-BOND 584-29 bond to?
A: CHO-BOND 584-29 is compatible with PCB, Metal Housings, EMI Shielding Applications. Surface preparation including cleaning and degreasing is recommended for optimal adhesion results.
Q: What package size is available?
A: This listing is for the 2.5 Gram CHO PAK format. Contact us for bulk pricing on larger quantities.
Q: How do I apply this adhesive correctly?
A: Ensure substrate surfaces are clean, dry, and free of contaminants. Apply per the manufacturer datasheet instructions, mix as required, apply to one or both surfaces, assemble parts, and allow to cure under recommended conditions of temperature and time before applying load.
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